ELECTRONIC COMPONENT MOUNTER AND ELECTRONIC COMPONENT MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide an electronic component mounter and an electronic component mounting method by which mounting failure can be eliminated when mounting electronic component of micro size to be supplied in tape. SOLUTION: This electronic component mounter is used to pick up an electronic component 14 in an emboss E of a tape T by a suction nozzle of a transfer head and mount it to a board. On the upstream side of the pickup position on a tape feeder for feeding the tape T, the tape T is sensed and recognized by a camera, thereby measuring a clearance between the emboss E and the electronic component 14 therein and controlling the action of the tape feeder or transfer head on the basis of the obtained measurement result. Thus, an optimal pickup action can be realized corresponding to the condition of the electronic component 14 in the emboss E and the generation of mounting failure can be reduced.