CERAMIC CIRCUIT BOARD

PROBLEM TO BE SOLVED: To overcome such a problem that current density is high on the curved part of an L-shaped metal terminal, large resistance heating is generated and melting occurs on the metal terminal. SOLUTION: In a ceramic circuit board attaching a metal circuit plate 3 to the upper face of...

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Bibliographische Detailangaben
1. Verfasser:	IGUCHI MASAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To overcome such a problem that current density is high on the curved part of an L-shaped metal terminal, large resistance heating is generated and melting occurs on the metal terminal. SOLUTION: In a ceramic circuit board attaching a metal circuit plate 3 to the upper face of a ceramic board 1 and a metal terminal 4 connected electrically to the metal circuit plate 3, the metal terminal 4 has an L shape having a connection part 4a joined to the upper face of the ceramic board 1 and a leg part 4b, and an angle part having an angle less than 100 degrees is not formed on the curved part of the L-shaped metal terminal 4.