METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To make the treatment characteristics of a plurality of wafers uniform by eliminating the influence of temperature changes caused by continuous treatment. SOLUTION: A method of manufacturing semiconductor device uses a apparatus having a treatment chamber in which the wafers ar...

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Bibliographische Detailangaben
1. Verfasser:	FUKAYA KAZUHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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