METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To make the treatment characteristics of a plurality of wafers uniform by eliminating the influence of temperature changes caused by continuous treatment. SOLUTION: A method of manufacturing semiconductor device uses a apparatus having a treatment chamber in which the wafers are successively and continuously treated and a preparatory chamber which supplies the wafers to the treatment chamber. In the method, temperatures of the wafers in the treatment chamber are fixed by controlling the temperatures of the wafers in the preparatory chamber correspondingly to the temperature changes which occur in the treatment chamber due to the continuous treatment. Since the temperatures of the treated wafers are fixed, the treatment characteristics of the wafers can be made uniform and the yield can be improved. In addition, since the temperature control is performed in the preparatory chamber, the treating time does not increase and no aging is required. Therefore, the consumption of dummy wafers can be reduced.