GAS INTRODUCING EQUIPMENT, AND EQUIPMENT AND METHOD FOR FILM FORMATION
PROBLEM TO BE SOLVED: To provide a gas introducing equipment and an equipment and a method for film formation which can suppress a decrease in film forming speed and prevent film thickness from being uneven when a thin film is formed on a base body by a CVD method. SOLUTION: A CVD device 1 has a sho...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a gas introducing equipment and an equipment and a method for film formation which can suppress a decrease in film forming speed and prevent film thickness from being uneven when a thin film is formed on a base body by a CVD method. SOLUTION: A CVD device 1 has a shower head 4 and a susceptor 5 installed opposite in a chamber 2, and raw material gas is supplied from a gas supply part 30 c connected to a gas supply hole 9 of the chamber 2 into the cavity Sc of the shower head 4. The raw material gas is sufficiently reduced in speed, mixed, and diffused in the cavity Sc. Further, the raw material gas in the cavity Sc is heated through a face plate 45 of the shower head 4. At this time, the internal height G of the cavity Sc is set larger than a distance D, the d diffusion of heat from the shower head 4 is limited, and the thermal insulation of the cavity Sc is increased to sufficiently heat the raw material gas. |
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