ELECTRONIC COMPONENT, CIRCUIT BOARD, AND PACKAGING BODY OF ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To provide an electronic component for obtaining sufficient connection strength and the packaging body of the electronic component, when packaging the electronic component by a conductive adhesive rather than solder. SOLUTION: On a surface that comes into contact with the conne...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electronic component for obtaining sufficient connection strength and the packaging body of the electronic component, when packaging the electronic component by a conductive adhesive rather than solder. SOLUTION: On a surface that comes into contact with the connection member of at least the circuit board of a terminal electrode 1 for constituting the electronic component, a layer 9 is formed, which is made of at least one metal selected from among Cr, Co, Al, Ta, Ti, Si, W, Nb, and V, or an alloy containing at least one metal. For example, a specific metal layer 9 is formed on the surface of a resistor element 8, and the terminal electrode 1 composed of the specific metal layer 9 and the electronic component are formed into one piece, by interposing the conductive adhesive 3 between a circuit board 5 and an electrode 4 to package the electronic component. |
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