CONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To obtain a conductive adhesive which can shorten the joining time and can improve the reliability in electrical characteristics of a joint in mounting electronic parts. SOLUTION: This conductive adhesive containing a thermosetting resin, conductive particles and a substance ca...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEZAWA HIROTERU, KITAE TAKASHI, NISHIYAMA TOSAKU, ISHIMARU YUKIHIRO, MITANI TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a conductive adhesive which can shorten the joining time and can improve the reliability in electrical characteristics of a joint in mounting electronic parts. SOLUTION: This conductive adhesive containing a thermosetting resin, conductive particles and a substance capable of generating heat by itself is used to allow the substance to generate heat by itself to thereby accelerate the cure of the thermosetting resin, shorten the cure time and lower the curing temperature.