METHOD FOR POSITIONING PATTERN PRINTED FILM

PROBLEM TO BE SOLVED: To provide a method for positioning a pattern printed film so that a predetermined pattern position is received in an acceptable dimensional tolerance when a pattern is thermally bonded to a resin substrate sheet under pressure. SOLUTION: When the pattern printed film 3 is ther...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA WATARU, OGURA TSUKASA, KURIAKI HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for positioning a pattern printed film so that a predetermined pattern position is received in an acceptable dimensional tolerance when a pattern is thermally bonded to a resin substrate sheet under pressure. SOLUTION: When the pattern printed film 3 is thermally bonded to the resin substrate sheet 1 under pressure, the pattern 2 of the pattern printed film 3 is partitioned and a positioning line 1 drawn on the surface of the pattern printed film 3 in a vertical direction from the end part thereof in a shape recognizable easily and certainly at a glance is added to be used.