ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide an electronic device capable of securing performance and reliability with no moisture-proof treatment on a circuit board. SOLUTION: Related to an electronic device 1, electronic parts 7a, 7b, and 7c are mounted on a circuit board 5 housed in a case 4. The case 4 is p...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI TOSHIKI, SAWARA FUJIO, ISHIKAWA TOMONORI, INA OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic device capable of securing performance and reliability with no moisture-proof treatment on a circuit board. SOLUTION: Related to an electronic device 1, electronic parts 7a, 7b, and 7c are mounted on a circuit board 5 housed in a case 4. The case 4 is provided with a ventilation pipe 8 which allows communication between the outside and inside of the case 4, with a metal filter 10 provided in the communication pipe 8. A thin metal wire of 0.1-0.5 mm in diameter is intertangled to be flocculent, which is compression-formed to produce the metal filter 10. With the metal filter 10 employed, a vapor in the air coming in from the outside of the case 4 is condensed and captured.