POLYMER AND METHOD OF MANUFACTURING THE SAME, AND COMPOSITION FOR FILM FORMING INCLUDING THE SAME

PROBLEM TO BE SOLVED: To provide a composition for film forming capable of baking in a short time, imparting a film having low dielectric constant excellent in heat resistance, adhesivity and resistance to cracking and a polymer and a method of manufacturing for the composition. SOLUTION: This polym...

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Hauptverfasser:	YAMADA KINJI, NISHIKAWA MICHINORI, SHINOHARA NOBUYASU, OKADA TAKASHI, EBISAWA MASAHIKO, SHIRATO KAORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a composition for film forming capable of baking in a short time, imparting a film having low dielectric constant excellent in heat resistance, adhesivity and resistance to cracking and a polymer and a method of manufacturing for the composition. SOLUTION: This polymer having a specific structure is obtained by reacting a specific dihalogen compound (e.g. 4,4'-bis(2-iodophenoxy) benzophenone) and a specific diethynyl compound (e.g. 4,4'-diethynyl diphenylether) in the presence of a catalyst. The composition for the film forming is obtained by dissolving the polymer in a solvent.