THERMAL HEAD AND ITS PRODUCTION METHOD
PROBLEM TO BE SOLVED: To securely fix a thermistor 1 to an insulating substrate 3 in a thermal head in which a heating part and the thermistor are integrally formed through the surface of the insulating substrate 3. SOLUTION: The thermistor 1 is sealed and fixed to the surface of the insulating subs...
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| creator | TAKAYAMA TOSHIJI |
| description | PROBLEM TO BE SOLVED: To securely fix a thermistor 1 to an insulating substrate 3 in a thermal head in which a heating part and the thermistor are integrally formed through the surface of the insulating substrate 3. SOLUTION: The thermistor 1 is sealed and fixed to the surface of the insulating substrate 3. In this case, it is preferable that a thermistor body is substantially directly arranged on the surface of the insulating substrate 3 and that a sealing member 4 has a resin as an essential component. |
| format | Patent |
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SOLUTION: The thermistor 1 is sealed and fixed to the surface of the insulating substrate 3. In this case, it is preferable that a thermistor body is substantially directly arranged on the surface of the insulating substrate 3 and that a sealing member 4 has a resin as an essential component.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CORRECTION OF TYPOGRAPHICAL ERRORS ; ELECTRICITY ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; PERFORMING OPERATIONS ; PRINTING ; RESISTORS ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021105&DB=EPODOC&CC=JP&NR=2002321399A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021105&DB=EPODOC&CC=JP&NR=2002321399A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKAYAMA TOSHIJI</creatorcontrib><title>THERMAL HEAD AND ITS PRODUCTION METHOD</title><description>PROBLEM TO BE SOLVED: To securely fix a thermistor 1 to an insulating substrate 3 in a thermal head in which a heating part and the thermistor are integrally formed through the surface of the insulating substrate 3. SOLUTION: The thermistor 1 is sealed and fixed to the surface of the insulating substrate 3. In this case, it is preferable that a thermistor body is substantially directly arranged on the surface of the insulating substrate 3 and that a sealing member 4 has a resin as an essential component.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>ELECTRICITY</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>RESISTORS</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAL8XAN8nX0UfBwdXRRcPRzUfAMCVYICPJ3CXUO8fT3U_B1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBkbGRobGlpaOxkQpAgDwHiPJ</recordid><startdate>20021105</startdate><enddate>20021105</enddate><creator>TAKAYAMA TOSHIJI</creator><scope>EVB</scope></search><sort><creationdate>20021105</creationdate><title>THERMAL HEAD AND ITS PRODUCTION METHOD</title><author>TAKAYAMA TOSHIJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002321399A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>ELECTRICITY</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>RESISTORS</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKAYAMA TOSHIJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKAYAMA TOSHIJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMAL HEAD AND ITS PRODUCTION METHOD</title><date>2002-11-05</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To securely fix a thermistor 1 to an insulating substrate 3 in a thermal head in which a heating part and the thermistor are integrally formed through the surface of the insulating substrate 3. SOLUTION: The thermistor 1 is sealed and fixed to the surface of the insulating substrate 3. In this case, it is preferable that a thermistor body is substantially directly arranged on the surface of the insulating substrate 3 and that a sealing member 4 has a resin as an essential component.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING RESISTORS SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
| title | THERMAL HEAD AND ITS PRODUCTION METHOD |
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