THERMAL HEAD AND ITS PRODUCTION METHOD

PROBLEM TO BE SOLVED: To securely fix a thermistor 1 to an insulating substrate 3 in a thermal head in which a heating part and the thermistor are integrally formed through the surface of the insulating substrate 3. SOLUTION: The thermistor 1 is sealed and fixed to the surface of the insulating subs...

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Bibliographische Detailangaben
1. Verfasser: TAKAYAMA TOSHIJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To securely fix a thermistor 1 to an insulating substrate 3 in a thermal head in which a heating part and the thermistor are integrally formed through the surface of the insulating substrate 3. SOLUTION: The thermistor 1 is sealed and fixed to the surface of the insulating substrate 3. In this case, it is preferable that a thermistor body is substantially directly arranged on the surface of the insulating substrate 3 and that a sealing member 4 has a resin as an essential component.