SURFACE ACOUSTIC WAVE DEVICE PRECURSOR, MANUFACTURING METHOD FOR SURFACE ACOUSTIC WAVE DEVICE, COMMUNICATION UNIT

PROBLEM TO BE SOLVED: To provide a surface acoustic wave device precursor, in which a chip can be downsized to increase the degree of design freedom so that the costs can be reduced and to provide a manufacturing method for a surface acoustic wave device and a communication unit. SOLUTION: A plurality of surface acoustic wave filter element precursors 1a are densely formed on a piezoelectric wave substrate 11. A probe use electrode pad 17 used for an inspection terminal is placed at a surrounding part at the outside of an area formed by bonding electrode pads 16 and wiring electrodes 15 of the surface acoustic wave filter element precursors 1a and in a dicing area surrounded by each area line 19 and removed by dicing. After inspecting the surface acoustic wave filter element precursors 1a by using the probe use electrode pad 17, the piezoelectric wafer substrate 11 is divided by the dicing along each area line 19.