BASE FOR PRINTED-WIRING BOARD AND PREPREG AND PRINTED- WIRING BOARD USING THE PREPREG

PROBLEM TO BE SOLVED: To provide a high-performance base for printed-wiring boards where costs are low, size and weight can be reduced, dielectric characteristics, heat resistance, hygroscopic heat resistance, and stability in dimensions are excellent, and change in the dimensions is small in a thic...

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Bibliographische Detailangaben
Hauptverfasser:	NAKABAYASHI IORI, YAMADA MASATAKA, NAKAHARA MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BRAIDING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COTTON-WOOL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS,NON-WOVEN FABRICS GENERAL PROCESSES OF COMPOUNDING IMPREGNATING OR COATING OF PAPER KNITTING LACE-MAKING MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARYMATERIAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY NON-WOVEN FABRICS ORGANIC MACROMOLECULAR COMPOUNDS PAPER NOT OTHERWISE PROVIDED FOR PAPER-MAKING PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D PRINTED CIRCUITS PRODUCTION OF CELLULOSE PULP COMPOSITIONS TEXTILES THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G TRIMMINGS WADDING WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a high-performance base for printed-wiring boards where costs are low, size and weight can be reduced, dielectric characteristics, heat resistance, hygroscopic heat resistance, and stability in dimensions are excellent, and change in the dimensions is small in a thickness direction where the metal plating section of a via hole and a conductive resin cannot be easily cut from metal wiring, and to provide a prepreg and a printed-wiring board using the prepreg. SOLUTION: The base for printed-wiring boards is a nonwoven fabric cloth which should be made of fiber where a melt point or decomposition temperature is set to 270 deg.C or higher, should contain polyphenylene sulfide fiber, and should have a thermal coefficient of expansion of +100×10 / deg.C to -100×10 / deg.C in a surface direction and that of +500×10 / deg.C to -500×10 / deg.C in a sectional direction at 200 to 300 deg.C. In addition, in the prepreg, resin varnish should be impregnated and contained into the base for printed-wiring boards. The printed- wiring board should be manufactured by the prepreg.