RESIN COMPOSITION HAVING HEAT-SEALING PROPERTY

PROBLEM TO BE SOLVED: To develop a resin composition excellent in protecting property of contents, unsealing property, or the like, when used, as a heat sealing layer for packaging films, or the like, used for various containers, particularly containers for foods. SOLUTION: This heat-sealing resin c...

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Bibliographische Detailangaben
Hauptverfasser:	TSUTSUMI KATSUAKI, IWASAKI KUNIO, TAKOSHI HIROTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To develop a resin composition excellent in protecting property of contents, unsealing property, or the like, when used, as a heat sealing layer for packaging films, or the like, used for various containers, particularly containers for foods. SOLUTION: This heat-sealing resin composition comprises (A) 60-97 wt.% ethylene-based multi-component copolymer composed of ethylene, a radically polymerizable acid anhydride and a radically polymerizable comonomer other than the acid anhydride, containing a unit derived from the radically polymerizable acid anhydride in the ethylene-based multi-component copolymer in a ratio of 0.1 to 5 wt.% and containing a unit derived from the radically polymerizable comonomer other than the acid anhydride in a ratio of 3 to 50 wt.%, (B) 40-3 wt.% tackiness-imparting resin and (C) a polyolefin resin.