METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD

PROBLEM TO BE SOLVED: To solve the problem that the accurate formation of a fine conductor pattern is difficult. SOLUTION: A method for manufacturing a ceramic circuit board comprises the steps of forming a through hole 25 of the shape corresponding to the conductor pattern on a film 20 adhered to a...

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Bibliographische Detailangaben
Hauptverfasser:	SHIGA MOTOTSUGU, SAKAKURA MITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve the problem that the accurate formation of a fine conductor pattern is difficult. SOLUTION: A method for manufacturing a ceramic circuit board comprises the steps of forming a through hole 25 of the shape corresponding to the conductor pattern on a film 20 adhered to a green sheet 10 by laser processing, filling a conductive paste 30 in the hole, drying the paste, and then separating the film 20 from the sheet 10.