METHOD OF DEPOSITING FILM ON FILM SUBSTRATE AND APPARATUS THEREFOR

PROBLEM TO BE SOLVED: To provide a method of depositing a film on a film substrate, by which film deposition is applied uniformly and continuously on the film substrate, and an apparatus therefor. SOLUTION: The apparatus is composed of a vacuum chamber connected to a vacuum source, a sputtering appa...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA TAKAHARU, KITAHATA AKIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of depositing a film on a film substrate, by which film deposition is applied uniformly and continuously on the film substrate, and an apparatus therefor. SOLUTION: The apparatus is composed of a vacuum chamber connected to a vacuum source, a sputtering apparatus provided on the wall surface of the vacuum chamber and a turn table to turn by a driving means provided in the vacuum chamber, an unwinding body drawing out the wound film substrate and a winding body winding the drawn film are provided on the nearly center part of the turn table and a transporting body for transporting the film substrate in a circular arc state is provided on the circumferential edge of the turn table.