ITO SPUTTERING TARGET

PROBLEM TO BE SOLVED: To provide an ITO(indium-tin-oxide) target which reduces the amount of particles caused by nodules generated on an erosion part in accordance with the increase of the cumulative use time of the target and the amount of particles caused by yellow powders deposited on a nonerosio...

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Bibliographische Detailangaben
Hauptverfasser:	HOSHINO HIROKUNI, UCHIUMI KENTARO, KUROSAWA SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an ITO(indium-tin-oxide) target which reduces the amount of particles caused by nodules generated on an erosion part in accordance with the increase of the cumulative use time of the target and the amount of particles caused by yellow powders deposited on a nonerosion part. SOLUTION: In the ITO sputtering target substantially consisting of indium, tin and oxygen, the non erosion part is made thinner than the erosion part to project the erosion part. Further, a shape obtained by connecting the plane including the erosion part and the plane including the nonerosion part by an obtuse-angled slant is formed. The surface roughness (Ra) of the erosion part is controlled to =1.0 μm.