SUBRACK STRUCTURE OF ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To obtain a subrack structure of an electronic apparatus of which the earthquake resistance is improved. SOLUTION: A pair of struts 104R, 104L are erected in a cabinet 102 of an electronic apparatus 10 and set with their mounting surfaces 104RA, 194LA faced rearwards. A subrack...

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Bibliographische Detailangaben
1. Verfasser:	HIDA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a subrack structure of an electronic apparatus of which the earthquake resistance is improved. SOLUTION: A pair of struts 104R, 104L are erected in a cabinet 102 of an electronic apparatus 10 and set with their mounting surfaces 104RA, 194LA faced rearwards. A subrack 12 to be mounted on the struts 104R, 104L is composed of a box-like subrack body 107 opened at the front and back sides and a mother board 14. The mother board 14 is mounted on the mounting surfaces 104RA, 104LA of the struts 104R, 104L by setscrews 122 located on the rear side of the body 107, together with the body 107. Thus, the mother board 14 having a plane structure functions as a brace for the struts 104R, 104L to strengthen the connecting condition.