PHOTOSETTING/THERMOSETTING RESIN COMPOSITION FOR PRINTED WIRING SUBSTRATE AND PRINTED WIRING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a photosetting/thermosetting resin composition for printed wiring substrate, with which crack resistance in a long-term reliability test is improved, and a printed wiring substrate with which long-term reliability is improved, constituted by forming solder resist coa...

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Bibliographische Detailangaben
Hauptverfasser:	YODA KYOICHI, KATO KENJI, SUDO TETSUYA, YAMADA TATSUICHI, NAKAJIMA TOMOE
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosetting/thermosetting resin composition for printed wiring substrate, with which crack resistance in a long-term reliability test is improved, and a printed wiring substrate with which long-term reliability is improved, constituted by forming solder resist coating from that composition. SOLUTION: In the phtosetting/thermosetting resin composition to be used for forming a solder resist for printed wiring substrate containing a photosetting component and a thermosetting component, the elastic modulus of a hardened object at a room temperature is from 0.5 to 3.0 GPa, preferably, of =2.4%. Such a photosetting/thermosetting resin composition can be a liquid-state form or form of photosensitive dry film as well.