RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUIT BOARD USING THE SAME AND METAL-CLAD LAMINATED PLATE

PROBLEM TO BE SOLVED: To provide a high heat-resistant printed circuit board meeting lead-free solder. SOLUTION: The objective resin composition comprises an epoxy resin, a curing agent, a hardening accelerator and mica constituted with iron ions and magnesium ions as the atoms constituting the crys...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HANAWA AKINORI, MURAI YASUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a high heat-resistant printed circuit board meeting lead-free solder. SOLUTION: The objective resin composition comprises an epoxy resin, a curing agent, a hardening accelerator and mica constituted with iron ions and magnesium ions as the atoms constituting the crystal. Woven or nonwoven glass fiber fabric is impregnated and heated to form the objective half-cured prepreg for printed circuit board. A metal foil is clad on the resultant prepreg to produce the objective metal-plated laminated plate.