PRINTED BOARD

PROBLEM TO BE SOLVED: To provide a printed board that can secure the connection reliability of solder even under a severe condition on an automobile and can prevent the occurrence of solder bridges without reducing the electronic parts mounting area of the board. SOLUTION: Electronic parts 6 are mou...

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Bibliographische Detailangaben
1. Verfasser:	HATAKEYAMA TOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed board that can secure the connection reliability of solder even under a severe condition on an automobile and can prevent the occurrence of solder bridges without reducing the electronic parts mounting area of the board. SOLUTION: Electronic parts 6 are mounted on the printed board P by the dip soldering method. On the board P, a plurality of terminal lands 1 is formed in at least the advanced direction of the board P when the parts 6 are mounted on the board P by the dip soldering method. On the surface of the board P, in addition, the wiring patterns 3a and 3a around the junctions between the terminal lands 1b and 1c at the last position or one position this side of the last position in the advancing direction of the board 5, and wiring patterns 3 and 3 connected to the lands 1b and 1c are exposed continuously from the lands 1b and 1c.