LIGHT COMMUNICATION CLOCK EXTRACTION AND DATA REPRODUCTION MODULE

PROBLEM TO BE SOLVED: To provide a light communication clock extraction and a data reproduction module for contriving the reduction of a cost required for packaging and mounting the device itself. SOLUTION: The light communication clock extraction and the data reproduction module are provided with a multi-layer circuit resin substrate 1 having a planar circuit and a mounting pattern and mounting a semiconductor device 4 on one face, and a hole-opened circuit resin substrate 2 joined on the resin substrate face mounting the semiconductor device and having larger thickness size than the thickness of the semiconductor device. The semiconductor device is stored in a recess part formed of the open part of the hole-opened circuit resin substrate and the exposed face of the multi-layer circuit resin substrate, the gap part of the inside of the recess part and the exposed face of the semiconductor device are molded by a sealing resin 5, and electronic parts 6 of R or the like is mounted on the opposite face side of the multi-layer circuit resin substrate.