METHOD OF MANUFACTURING VIA PLUG

PROBLEM TO BE SOLVED: To provide a manufacturing method for a via plug, which is also applicable to the manufacturing method for a general size of via plug, in addition to being used for the induction coil contact within a radio communication apparatus by manufacturing a metallic plug which is simpl...

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Bibliographische Detailangaben
Hauptverfasser:	LEE SEIJIN, RYU SHUNJO, O SHOYU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method for a via plug, which is also applicable to the manufacturing method for a general size of via plug, in addition to being used for the induction coil contact within a radio communication apparatus by manufacturing a metallic plug which is simple of structure and is free of impurities, thereby getting a high-quality via plug. SOLUTION: A via hole is made in a ceramic substrate, and then a metal thin film is formed on the hole wall of the via hole by physical vapor deposition method or chemical vapor deposition method. Next, the metal thin film made beforehand is plated with metal, making use of electrical plating method or electroless plating method, thereby manufacturing a metallic plug within the via hole, which satisfies the needs of electrical conductivity.