ELECTROPLATING APPARATUS

PROBLEM TO BE SOLVED: To provide an electroplating apparatus which allows symplification of the apparatus, reduces the time and plating solution required for the treatment and improves the plating quality. SOLUTION: A retaining part 40 for retaining a semiconductor wafer 71, with its surface (the surface subjected to plating treatment) faced-up, in contact with a cathode 31, and an anode 30 positioned above the retaining part 40 are coupled to an elevator 50 to enable vertical movement. A plating tank 60 is positioned below these. Electroplating is performed by sending down the retaining part 40 and the anode 30 and soaking them in a plating solution 61 inside the plating tank 60 together with the semiconductor wafer 71.