INTER-LAYER CONNECTION HOLE AND ITS MANUFACTURING METHOD

INTER-LAYER CONNECTION HOLE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To make a printed wiring board thin. SOLUTION: On an insulation resin layer 2 as a 1st layer, the inter-layer circuit 3 is formed, and on this inter-layer circuit 3, an insulation resin layer 4 as a 2nd layer is formed. In this insulation resin layer 4, a non-through hole is fo...

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Bibliographische Detailangaben
Hauptverfasser: IWASAKI YASUHIRO, FUKUSATO KENSHIROU, NISHIDA TAKANORI, ISODA SATOSHI, HIRANO AKIKO
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To make a printed wiring board thin. SOLUTION: On an insulation resin layer 2 as a 1st layer, the inter-layer circuit 3 is formed, and on this inter-layer circuit 3, an insulation resin layer 4 as a 2nd layer is formed. In this insulation resin layer 4, a non-through hole is formed with carbon dioxide laser beam. Then an electroless copper plating layer 12 is provided on the internal wall of the non-through hole by a full- additive method to form a on-through connection hole 13.