SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein adherence between an organic resin film like a polyimide film which is formed on a semiconductor device and molding resin for sealing the organic resin film is improved, and to provide a method for manufacturing the semiconductor device...

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1. Verfasser: SHINOHARA MASAHIDE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SHINOHARA MASAHIDE
description PROBLEM TO BE SOLVED: To provide a semiconductor device wherein adherence between an organic resin film like a polyimide film which is formed on a semiconductor device and molding resin for sealing the organic resin film is improved, and to provide a method for manufacturing the semiconductor device. SOLUTION: In this semiconductor device, a polyimide film 16 is formed on a semiconductor substrate 11 on which an element and a wiring pattern 14 are formed, and resin sealing is performed by using sealing resin. Unevenness 16b is formed at least on a part of a surface of the polyimide film 16.
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SOLUTION: In this semiconductor device, a polyimide film 16 is formed on a semiconductor substrate 11 on which an element and a wiring pattern 14 are formed, and resin sealing is performed by using sealing resin. Unevenness 16b is formed at least on a part of a surface of the polyimide film 16.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
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