SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein adherence between an organic resin film like a polyimide film which is formed on a semiconductor device and molding resin for sealing the organic resin film is improved, and to provide a method for manufacturing the semiconductor device...

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Bibliographische Detailangaben
1. Verfasser:	SHINOHARA MASAHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device wherein adherence between an organic resin film like a polyimide film which is formed on a semiconductor device and molding resin for sealing the organic resin film is improved, and to provide a method for manufacturing the semiconductor device. SOLUTION: In this semiconductor device, a polyimide film 16 is formed on a semiconductor substrate 11 on which an element and a wiring pattern 14 are formed, and resin sealing is performed by using sealing resin. Unevenness 16b is formed at least on a part of a surface of the polyimide film 16.