ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To solve the problem of SBB method which uses wire bonding of inferior productivity for forming bumps in an electronic component and each formed bump by the wire bonding is in a port-belly shape, composed of a base and a smaller top than the base to result in that the transfer of adhesives to the bump being unstable, and hence the connection of a semiconductor device with a support base being apt to be unstable. SOLUTION: A bump 212 comprises a base 103 fixed to a substrate electrode 315, provided at a semiconductor device 101 and a top 104, formed at the substrate electrode 315 on the base 103 and has an outside diameter 105 of the top end of the top 104 at the electrode 315 larger than the outside diameter of the top 104 at the base 103. The bump holds surely a conductive adhesive with the top 104 to surely connect the semiconductor device 101 to the substrate electrode 315 and turning them into a mounting structure.