SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a manufacturing method, as a method of manufacturing a surface acoustic wave device which is mounted by a flip-chip bonding system via a bump, in which an electrode pad is hard to strip from a piezoelectric substrate, in the formation or the like of the bump and in which cracks are not likely to be generated in the piezoelectric substrate. SOLUTION: In the method of manufacturing the surface acoustic wave device, first electrode layers 2a on the electrode pad are formed on the piezoelectric substrate 1 through etching operation; after the layers 2a have been formed, electrodes 5a for a surface acoustic wave element are formed by the lift-off method; and an electrode film which comprises second electrode layers 7a and wiring electrodes 7a on the electrode pad are formed.