CIRCUIT CHIP FOR HIGH FREQUENCY AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a low cost chip for a high frequency circuit which is small in size and has a fine and highly precise pattern, and method for manufacturing the chip for the high frequency circuit capable of effectively manufacturing the chip for the high frequency circuit. SOLUTION:...

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Bibliographische Detailangaben
Hauptverfasser:	HATADA MITSUNORI, TONAMI YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a low cost chip for a high frequency circuit which is small in size and has a fine and highly precise pattern, and method for manufacturing the chip for the high frequency circuit capable of effectively manufacturing the chip for the high frequency circuit. SOLUTION: In manufacturing the chip for the high frequency circuit in which an interconnection pattern 2 is arranged on a substrate 1 with a through hole 7, (a) an electrode 7a for conduction of the through hole 7 is formed by filling and sintering a conductive paste in a through hole 11 and (b) an interconnection pattern 2 is formed using a lift-off method as well. In addition, at least a surface of the substrate 1 on which the interconnection pattern 2 is to be formed is mirror-polished, subsequently the interconnection pattern 2 is formed using the lift-off method on the mirror polished surface.