METHOD FOR FORMING PROTECTIVE PACKAGE AND MOLD FOR FORMING PROTECTIVE PACKAGE

METHOD FOR FORMING PROTECTIVE PACKAGE AND MOLD FOR FORMING PROTECTIVE PACKAGE

PROBLEM TO BE SOLVED: To provide a protective package for an electronic device where yield is improved without damaging an electronic device stored therein. SOLUTION: A method for forming the protective package comprises a step of using a mold 10, the mold comprising a half mold 15 that has a lug di...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CIGADA ANDREA, MAGNI PIERANGELO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a protective package for an electronic device where yield is improved without damaging an electronic device stored therein. SOLUTION: A method for forming the protective package comprises a step of using a mold 10, the mold comprising a half mold 15 that has a lug directing toward the inside of the mold, the lug being capable of elastic deformation and comprising one end having an element 17 that comes into contact with at least a part of an electronic circuit 13 by pressurizing contact, and a step of injecting resin into the mold so that the protective package has a hole part aligned with at least the part of the electronic circuit.