EASILY SLIDABLE POLYIMIDE FILM AND ITS PRODUCTION METHOD

PROBLEM TO BE SOLVED: To provide an easily slidable polyimide film suitable for a flexible printing board without generating an intrusion of bubbles and a cissing of an adhesive in coating an adhesive, while eliminating a bad apparatus due to aggregation of filler grains and an non-uniformity due to...

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Bibliographische Detailangaben
Hauptverfasser:	AIHAMA YUTAKA, OKABASHI MASAKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an easily slidable polyimide film suitable for a flexible printing board without generating an intrusion of bubbles and a cissing of an adhesive in coating an adhesive, while eliminating a bad apparatus due to aggregation of filler grains and an non-uniformity due to sedimentation. SOLUTION: This easily slidable polyimide film is obtained by film-coating and imide-forming from a polyamide acid solution having filler grains, wherein a surface roughness of film Rmax is blow 2 μm or below and a coefficient of static friction between film surfaces is 0.1-1.2.