HEAT SINK AND MODULE STRUCTURE USING THE HEAT SINK

HEAT SINK AND MODULE STRUCTURE USING THE HEAT SINK

PROBLEM TO BE SOLVED: To provide a superior reliability and inexpensive module structure having high heat radiation properties. SOLUTION: A heat sink is made of a copper alloy having a Vickers hardness of at least 70 HV after heat treatment for 4 minutes at 630 deg.C. The module structure uses the h...

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Bibliographische Detailangaben
Hauptverfasser: SUGIMOTO ISAO, EMOTO HIDEYUKI, UTO MANABU, IBUKIYAMA MASAHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a superior reliability and inexpensive module structure having high heat radiation properties. SOLUTION: A heat sink is made of a copper alloy having a Vickers hardness of at least 70 HV after heat treatment for 4 minutes at 630 deg.C. The module structure uses the heat sink and has a structure where a ceramic circuit board is integrated with the heat sink via a brazing material.