HEAT SPREADER AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a heat spreader improved in heat dissipation properties, injection efficiency in mold resin, and mold adherence. SOLUTION: This heat spreader is formed so that one portion is embedded in the mold resin 4, and insert molding can be made by covering nearly the same are...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a heat spreader improved in heat dissipation properties, injection efficiency in mold resin, and mold adherence. SOLUTION: This heat spreader is formed so that one portion is embedded in the mold resin 4, and insert molding can be made by covering nearly the same area as a portion that is covered with the mold resin on a wiring board 1 including the upper surface of a semiconductor chip 2 that is mounted onto the wiring board 1, and by widely securing an area that is exposed from the mold resin 4 to the outside. |
|---|