CONTINUOUS SHEET FOR PRESSURE-CONTACTING BALL-SHAPED BUMP OF SEMICONDUCTOR COMPONENT

CONTINUOUS SHEET FOR PRESSURE-CONTACTING BALL-SHAPED BUMP OF SEMICONDUCTOR COMPONENT

PROBLEM TO BE SOLVED: To improve reliability of contact, in a continuous sheet which has a contact pad provided with a relief part receiving a lower spherical surface of a ball-shaped contact-point bump, by keeping sufficiently a contact pressure between an inside edge part of a contact pad in which...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: OKUNO TOSHIO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve reliability of contact, in a continuous sheet which has a contact pad provided with a relief part receiving a lower spherical surface of a ball-shaped contact-point bump, by keeping sufficiently a contact pressure between an inside edge part of a contact pad in which a relief part is formed and a lower spherical surface of a ball-shaped contact bump. SOLUTION: The inside edge part 6 of the pad 4 in which a relief part 5 of the contact pad 4 is formed is triangular, the lower spherical surface of the ball-shaped contact bump 3 is pressure-contacted with each of sides 6a of the triangular inside edge part 6 at its three points.