WATER-BASED ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To provide a water-based adhesive composition for poorly adhesive materials, housing materials or the like, having heat resistance, high-temperature creep resistance and water resistance, capable of low-temperature laminating adhesion at normal temperatures or lower, and contai...

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Bibliographische Detailangaben
Hauptverfasser:	ORIGUCHI TOSHIKI, SHIMOMA SUMIYA, HAMADA KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a water-based adhesive composition for poorly adhesive materials, housing materials or the like, having heat resistance, high-temperature creep resistance and water resistance, capable of low-temperature laminating adhesion at normal temperatures or lower, and containing no volatile organic compound. SOLUTION: This water-based adhesive composition comprises (A) a polymer emulsion prepared by emulsion polymerization, in a polyvinyl alcohol-containing ethylene-vinyl acetate-polyfunctional monomer-based copolymer emulsion >=70 mass% in toluene insolubles and 25-35 mass% in ethylene content, of 20-100 pts.mass, based on 100 pts.mass polymer solids of the above emulsion, of polymerizable unsaturated monomers containing 20-70 mass% of the unsaturated monomer of an acroyl compound with 6-10C alkyl to effect polymerizing 20-70 pts.mass of the unsaturated monomer of the above acroyl compound based on 100 pts.mass of polymer solids of the above emulsion and (B) an anionic polyurethane emulsion.