SUBSTRATE AND ELECTRONIC EQUIPMENT HAVING SUBSTRATE

SUBSTRATE AND ELECTRONIC EQUIPMENT HAVING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a substrate and electronic equipment, having a substrate with superior reliability in electrical connections, in which a conductor portion will not peel, when electronic components are electrically connected by using a lead-free solder. SOLUTION: A substrate 1, on wh...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TOYAMA TOSHIO, TOMIZUKA KENICHI, HORIKAWA YASUTAKA, ORUI KEN
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate and electronic equipment, having a substrate with superior reliability in electrical connections, in which a conductor portion will not peel, when electronic components are electrically connected by using a lead-free solder. SOLUTION: A substrate 1, on which an electronic component P is mounted and which is electrically connected to the electronic component, includes an electrically insulating base material, a resist portion formed on the base material and a conductor portion 5, 6 made on the surface of the base material for conducting electricity. Since the resist portion covers part of the conductor portion 5, 6, the remaining portion of the conductor portion 5, 6, except for the aforementioned part of the conductor portion 5, 6, forms lands 20, 30 for electrically connecting the electronic component P.