METHOD AND DEVICE FOR CUTTING WITH LASER BEAM

PROBLEM TO BE SOLVED: To provide a device for cutting with laser bema which surely prevents molten and splashed matter generated at the cutting work of a resin sheet from sticking onto the periphery of the cutting part. SOLUTION: The cutting device with laser bema is provided with a laser beam irrad...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OZAKI SHUJI, OYABU YOSHIMI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a device for cutting with laser bema which surely prevents molten and splashed matter generated at the cutting work of a resin sheet from sticking onto the periphery of the cutting part. SOLUTION: The cutting device with laser bema is provided with a laser beam irradiation part, which cuts the resin sheet 2 guided on a supporting member 11 by making the sheet irradiated with a laser beam for cutting, and a container 12 for trapping which is arranged under the supporting member 11 and traps by a suction of air the molten and splashed matter generated when the resin sheet 2 is cut. The cutting device is characterized by that the a container 12 for trapping is provided with a suction port for air which sucks the air, an injection nozzle 27 for cooling water which cools the molten and splashed material by injecting the cooling water, and the sticking and solidification of the molten and splashed matter on periphery of the cutting part is prevented by injecting the cooling water from the injection nozzle 27 for water upon the molten and splashed matter which is sucked into the container 12 for trapping.