CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a circuit board capable of effectively preventing a migration and having high reliability. SOLUTION: The circuit board comprises glass layers 2 coating on an upper surface of a board 1, a plurality of conductor layers 3, each made of a conductive material containing...

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Bibliographische Detailangaben
Hauptverfasser:	TOMIYAMA AKITOSHI, SHIGETA YASUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a circuit board capable of effectively preventing a migration and having high reliability. SOLUTION: The circuit board comprises glass layers 2 coating on an upper surface of a board 1, a plurality of conductor layers 3, each made of a conductive material containing silver or aluminum and coating on the layer 2, and a plating layer 4 made of at least one type which is selected from among a group consisting of nickel, chromium and gold and coating the surface of the layer 3. In this board, the layers 2 disposed at both sides of the layer 3 are partly protruded, so as to coat an outer periphery of the layer 3, and a distal end of the protrusion 2a is interposed between the layer 3 and the layer 4.