METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To enable a low dielectric constant insulating film to be certainly inserted between wirings having a small wiring pitch, and to prevent the occurrence of defects such as exfoliations or scratches in the low dielectric constant insulating film. SOLUTION: After having formed a f...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IKURA TSUNEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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