METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To increase the number of products being acquired by single resin injection. SOLUTION: In the method for manufacturing a semiconductor device resin sealed on one side of a substrate, upper and lower dies for resin sealing are provided, respectively, with a cavity for injecting...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IMURA KENICHI, SUZUKI KAZUNARI, KURATOMI BUNJI, KAWADA YOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To increase the number of products being acquired by single resin injection. SOLUTION: In the method for manufacturing a semiconductor device resin sealed on one side of a substrate, upper and lower dies for resin sealing are provided, respectively, with a cavity for injecting resin. Two substrates are laid in layers while facing the non-resin sealed sides each other and set between the upper and lower dies before injecting sealing resin into the cavities of both upper and lower dies. According to the arrangement, the number of semiconductor devices being resin sealed by single injection can be doubled using an existing facility, as it is.