GLASS CERAMIC AND METHOD FOR MANUFACTURING THE SAME, AND CIRCUIT SUBSTRATE USING THE GLASS CERAMIC

PROBLEM TO BE SOLVED: To provide a glass ceramic which can be sintered at a temperature of 1050 deg.C or lower, can be sintered synchrously with a conductor, the main ingredient of which is Cu or Ag, having high thermal conductivity, high strength, excellent water resistance, low dielectric constant...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IWACHI HIROMI, TERASHI YOSHITAKE
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a glass ceramic which can be sintered at a temperature of 1050 deg.C or lower, can be sintered synchrously with a conductor, the main ingredient of which is Cu or Ag, having high thermal conductivity, high strength, excellent water resistance, low dielectric constant and low dielectric loss. SOLUTION: A circuit substrate 1 (package for accommodating semiconductor elements) is produced by forming a conductive wiring layer 3 on the surface of and/or the inside of an insulated substrate 2 which is composed of glass ceramics produced by dispersing AlN grains, the mean grain diameter of which is 2 μm or more, in a glass and/or a glass crystallized matrix, and the metallic Al content of which is 800 ppm or less to the total amount.