PREPREG FOR PRINTED WIRING BOARD AND LAMINATE USING IT

PROBLEM TO BE SOLVED: To provide a prepreg, for a printed wiring board which is superior in storage stability and moldability, and to provided a laminate which is superior in heat resistance and a glass transition temperature (Tg). SOLUTION: A glass woven fabric or a glass nonwoven fabric is impregn...

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Bibliographische Detailangaben
Hauptverfasser:	HANAWA AKINORI, MURAI YASUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a prepreg, for a printed wiring board which is superior in storage stability and moldability, and to provided a laminate which is superior in heat resistance and a glass transition temperature (Tg). SOLUTION: A glass woven fabric or a glass nonwoven fabric is impregnated with a varnish wherein an epoxy resin modified by an aromatic diisocyanate, a hardener, an accelerator and an inorganic filler are contained in the molecular structure of the epoxy resin, and it is heated. The prepreg for the printed-wiring board which is changed into a B stage is formed, metal foils are laminated on one face or both faces of the prepreg, and they are heated, pressurized and molded to obtain a metal-clad laminate.