METHOD OF REMOVING SACRIFICE MATERIAL AND METAL CONTAMINANT ON SILICON SURFACE

PROBLEM TO BE SOLVED: To provide a novel method for removing a sacrifice material and a metal contaminant from a silicon surface, when an integrated micro mechanical device and an integrated micro electronic device are manufactured on a single chip. SOLUTION: This method includes a process for regulating a chip temperature to a temperature proper to β-diketone and design for the micro mechanical device and the micro electronic device, using a reaction chamber, a process for cycle-purging the reaction chamber using inert gas to remove the atmospheric gas and a trace amount of moisture, a process for introducing HF and β-diketone as a reactive mixture into the reaction chamber storing at least one etched base material, a process for making the reactive mixture flow on the base material until the sacrifice material and the metal contaminant are substantially removed, a process for stopping the flow of the reactive mixture, and a process for cycle-purging the reaction chamber to remove the remaining reactive mixture and a remaining reaction by-product.