POLISHING PAD

PROBLEM TO BE SOLVED: To provide a polishing pad capable of restraining generation of defects due to air inclusion more than before. SOLUTION: In a polishing pad at which released paper 6 is affixed onto the back surface of a pad section 2 for polishing through an adhesive sheet 3 and which is fixed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	ANZAI KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polishing pad capable of restraining generation of defects due to air inclusion more than before. SOLUTION: In a polishing pad at which released paper 6 is affixed onto the back surface of a pad section 2 for polishing through an adhesive sheet 3 and which is fixed onto a surface plate 7 of a polishing machine after the released paper is removed before its use, a communicating hole 8 is formed in the surface of the pad section from the back surface fixed onto the surface plate 7.