METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method for improving positioning precision between inner layer materials in a combination body after temporary tacking even if the inner layer material is thin. SOLUTION: In the manufacturing method of a multilayer printed wiring board, positioning pi...

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Hauptverfasser: YOSHIDA SHOICHI, HAMATSU TSUTOMU
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator YOSHIDA SHOICHI
HAMATSU TSUTOMU
description PROBLEM TO BE SOLVED: To provide a manufacturing method for improving positioning precision between inner layer materials in a combination body after temporary tacking even if the inner layer material is thin. SOLUTION: In the manufacturing method of a multilayer printed wiring board, positioning pins 3 which are erected on a base plate 1 and are fitted to the base plate 1 so that they can move in a planar direction in pin bearings 2 arranged in the base plate 1 are inserted into positioning holes formed in the inner layer materials of the combination body 7. The combination body 7 is set and a pin fixing board 10 where the pin fixing holes are formed is arranged above the combination body 7. The positioning pins 3 are inserted into the pin fixing holes and the planar position is fixed. The inner layer materials of the combination body 7 are positioned. Then, temporary tacking for preventing dislocation between the inner layer materials is performed on the combination body 7.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
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