METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method for improving positioning precision between inner layer materials in a combination body after temporary tacking even if the inner layer material is thin. SOLUTION: In the manufacturing method of a multilayer printed wiring board, positioning pi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSHIDA SHOICHI, HAMATSU TSUTOMU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method for improving positioning precision between inner layer materials in a combination body after temporary tacking even if the inner layer material is thin. SOLUTION: In the manufacturing method of a multilayer printed wiring board, positioning pins 3 which are erected on a base plate 1 and are fitted to the base plate 1 so that they can move in a planar direction in pin bearings 2 arranged in the base plate 1 are inserted into positioning holes formed in the inner layer materials of the combination body 7. The combination body 7 is set and a pin fixing board 10 where the pin fixing holes are formed is arranged above the combination body 7. The positioning pins 3 are inserted into the pin fixing holes and the planar position is fixed. The inner layer materials of the combination body 7 are positioned. Then, temporary tacking for preventing dislocation between the inner layer materials is performed on the combination body 7.