MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To improve efficiency in the lithography process of processes for manufacturing a semiconductor integrated circuit device. SOLUTION: For each semiconductor wafer 1, several processes are carried out, where the processes include a process for depositing a photosensitive organic...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	IRIKITA NOBUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve efficiency in the lithography process of processes for manufacturing a semiconductor integrated circuit device. SOLUTION: For each semiconductor wafer 1, several processes are carried out, where the processes include a process for depositing a photosensitive organic film, a process for performing exposure treatment, a process for performing processing, and an inspection process. Then, the photosensitive organic film of the semiconductor wafer 1 that has been determined to be out of standard by the inspection process is removed in a treatment section for depositing the photosensitive organic film for returning the process for depositing the photosensitive organic film again and resuming the processes for the semiconductor wafer 1 to regenerate the semiconductor wafer 1. In a system for carrying out the series of processes, other treatment is automatically made in parallel to other semiconductor wafers 1 in the group of semiconductor wafers 1 during the regeneration treatment of the semiconductor wafer 1.