METHOD FOR FORMING PLATED LAYER AND PLATING EQUIPMENT

PROBLEM TO BE SOLVED: To provide a method for forming a plated layer which fills a fine groove or a hole formed on the surface to be treated of a substance to be treated with a plating material, to no void, and which can increase productivity through enhancing a film forming speed on the surface to be treated, and to provide plating equipment. SOLUTION: This forming method includes forming the first plated film on a site to be plated, by contacting the substance to be treated with the first plating solution having the first chloride ion concentration of a copper sulfate aqueous solution, which includes a composition for accelerating plating and a composition for controlling the plating; and forming the second plated film on the site on which the first film has been formed, by contacting the treated substance on which the first film has been formed, with the second plating solution having the second chloride ion concentration, which is lower than that in the first plating solution. The second plating solution weakens an effort of the composition for controlling plating, and forms the plated layer efficiently.